ZHANG, Lu. Quality Prediction and Process Optimization for Silicon Wafer Diamond Wire Sawing Based on Simcenter AI Studio. Artificial Intelligence and Digital Technology, [S. l.], v. 3, n. 3, p. 32–40, 2026. DOI: 10.70088/fyaqxp14. Disponível em: https://soapubs.com/index.php/AIDT/article/view/2516.. Acesso em: 2 aug. 2026.