CHEN, Tao; LIU, Huilin. Influence of Surface Morphology and Micro-Defects on the Electrical Performance and Implied Mechanical Reliability of Fine-Pitch Copper Bonding Wires. Artificial Intelligence and Digital Technology, [S. l.], v. 2, n. 1, p. 34–40, 2025. DOI: 10.70088/9fz4mv71. Disponível em: https://soapubs.com/index.php/aidt/article/view/602.. Acesso em: 18 aug. 2025.